化学机械研磨材料-

领先的创新提供最佳的化学机械抛光垫空调类	Abrasive Technology's diamond CMP (chemical mechanical planarization) pad conditioners are precisely manufactured for the highest productivity in semiconductor wafer processing.磨料技术的CMP（化学机械研磨）垫正是制造冷气的最高生产力的半导体晶片加工。 As the electronics and semiconductor industries thrive, Abrasive Technology stands committed to exceeding the CMP needs of the world's major semiconductor device manufacturers, and semiconductor equipment manufacturers.随着电子和半导体行业的蓬勃发展，磨料技术站致力于CMP需求超过了世界主要半导体设备制造商，以及半导体设备制造商。 Abrasive Technology offers a leading-edge bonding system that outshines competitors' products to achieve the highest quality standards.磨料技术提供了领先的粘接系统outshines竞争对手的产品达到最高质量标准。 What makes our CMP pad conditioners the best in class?是什么让我们的CPM的最佳？ The PBS® bonding system.在PBS ®粘接系统。
The PBS® Brand Advantage 在PBS ®品牌优势	Traditionally, CMP pad conditioners have been constructed using electroplated nickel as the bonding medium between diamond crystals and the substrate.传统上，CMP已经采用电镀镍之间的结合中的钻石晶体和底物。 However, this bonding method is prone to crystal loss during the CMP pad conditioning process.然而，这种绑定方法很容易丧失晶体化学机械抛光垫在空调进程。 That's where Abrasive Technology's patented process (US Patent No. 5,511,718) comes into play.这就是磨料技术的专利工艺（美国专利号5511718 ）发挥作用。 Abrasive Technology offers this unique process to increase crystal retention while at the same time creating a tool that is more aggressive and far less prone to loading up with debris.磨料技术提供了这个独特的进程，以增加晶体保留，同时创造一个工具，更积极和深远不易装载了碎片。 What this translates into for Abrasive Technology's worldwide这转化为磨料技术的全球 customers is客户 * Higher wafer yield *高级晶圆产量 * Increased process reliability *增加过程可靠性 * Lowest cost of ownership *最低的拥有成本 * Profitability *盈利
Abrasive Technology's Global Presence 磨料技术的全球影响力	Technical innovation is the name of the game at Abrasive Technology.技术创新是市场的游戏在磨料技术。 As the worldwide leader in superabrasive grinding and tooling, Abrasive Technology and its associates are strongly committed to designing, developing and manufacturing state-of-the-art products to meet the challenging needs of the semiconductor industry.作为全球领先的超硬磨料和模具，磨料技术及其同伙坚决致力于设计，开发和制造的最先进的产品，以满足需求的挑战，半导体产业。 With more than 30 years of superabrasive grinding expertise to its credit, the Company believes in global presence with 11 manufacturing locations around the globe to meet and ultimately exceed customer expectations.拥有30多年的超硬磨料的专门知识，其信贷，公司认为在全球有11个生产基地在全球各地，以满足并最终超越客户的期望。

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