The Global Leader in CMP Pad Conditioners

Leading Innovations Deliver Best in Class CMP Pad Conditioners

Abrasive Technology's diamond CMP (chemical mechanical planarization) pad conditioners are precisely manufactured for the highest productivity in semiconductor wafer processing. As the electronics and semiconductor industries thrive, Abrasive Technology stands committed to exceeding the CMP needs of the world's major semiconductor device manufacturers, and semiconductor equipment manufacturers.

Abrasive Technology offers a leading-edge bonding system that outshines competitors' products to achieve the highest quality standards. What makes our CMP pad conditioners the best in class? The P.B.S.® bonding system.

The P.B.S.® Brand Advantage

Traditionally, CMP pad conditioners have been constructed using electroplated nickel as the bonding medium between diamond crystals and the substrate. However, this bonding method is prone to crystal loss during the CMP pad conditioning process. That's where Abrasive Technology's patented process (US Patent No. 5,511,718) comes into play. Abrasive Technology offers this unique process to increase crystal retention while at the same time creating a tool that is more aggressive and far less prone to loading up with debris.

What this translates into for Abrasive Technology's worldwide
customers is
* Higher wafer yield
* Increased process reliability
* Lowest cost of ownership
* Profitability

Abrasive Technology's Global Presence

Technical innovation is the name of the game at Abrasive Technology. As the worldwide leader in superabrasive grinding and tooling, Abrasive Technology and its associates are strongly committed to designing, developing and manufacturing state-of-the-art products to meet the challenging needs of the semiconductor industry. With more than 30 years of superabrasive grinding expertise to its credit, the Company believes in global presence with 11 manufacturing locations around the globe to meet and ultimately exceed customer expectations.

The P.B.S.® plating process dramatically increases diamond retention due to its unique method of bonding the individual diamonds to the disk.

Product Features:
• Strong, premium quality diamond
• Strong bond between crystal and substrate
• Consistent pad conditioning
• Lowest cost of ownership
• Product certification

ATI's pad conditioners are available for all CMP equipment including:
• Applied Materials
• Ebara
• Speedfam-IPEC
• Strasbaugh
• Lam Research

Optimized Diamond Pad Conditioners
Abrasive Technology is ISO 9001:2000 certified

Abrasive Technology is pleased to introduce a diamond conditioning
disk that utilizes a proprietary, patented process to optimize pad
conditioning results.

Compared to previous disks, these disks offer:
• Lowest cost of ownership
• Greater crystal support & overall diamond retention
• Increased part to part consistency
• Over 60% disk life gain
• Over 80% bond strength increase
• Smooth RAS decay over extended lifetime
• The P.B.S.® advantage

These metal CMP disks are available in production quantities in
various shapes and sizes for all production CMP platforms.